WHAT IS THE FUTURE PACKAGING?

"Get In The Ring" - Facing up to the challenges of future manufacturing

Time waits for no man – and the same seems true for the pace of innovation in electronics. Be it Industrie 4.0, the IoT, or the IoP: Every square inch of our private and professional worlds is being taken over by new hardware, set to make everything more efficient and more comfortable. The internet as we know it, invented to be a means of sharing information, is going through a paradigm change and evolving into an intelligent bus system for all kinds of monitoring, sensor, or control signals. Many, if not most modern electronic systems operate to a large degree on a distributed basis. The place where data is recorded or created is different from the place where that data is processed, and different yet again from the place where physical actions happen as a result. Each entity in this chain is housed in a different device or package, designed to match the requirements of their specific environments and only connected to each other by the intangible links of the internet.

With each component in the system physically separate and technically independent, development cycles are accelerating greatly for a vast range of use cases. What they all have in common is the need for a new level of connectivity for data and signals. 5G has the potential to spark new progress at record-breaking pace, made possible by greater bandwidth and better coverage.

For manufacturers, this means a need for new and more efficient machines, processes, and technologies that can keep pace with the scalability and flexibility of the new technological opportunities.

The production line at the »Future Packaging« exhibit will give visitors at SMTconnect 2019 a first-hand experience of how efficient and robust processes and technologies can be achieved with a maximum of flexibility. All members of the collective exhibit are fully aware of their responsibility for working closely with their clients to solve the challenges in the market - Questions and discussions are welcome and encouraged.