Wagenbrett GmbH & Co. KG

This year, we present our enhanced semiconductor product range. The well-established WB300 can now process products with ball diameters down to 100 µm (smaller diameters on request). Additionally, the PB46 - Printing & Balling Station opens up new possibilities in solder ball placement and flux printing on BGA’s. Various other products, like heat-resistant Wafer Cassettes, will also be displayed.

WB300 - Solder Ball Placement
- Products: Wafer, BGA, Substrates, etc.
- Applications: R&D, Volume Production, Rework
- Product Size: ≤ 300 mm / 12 inch
- Ball Diameter: ≥ 100 µm (smaller diameters on request)
- Throughput: ≥ 20 Products / hour
- Changeover Time: ≤ 30 min.

PB46 - Solder Ball Placement & Flux Printing
- Products: BGA, etc.
- Applications: Rework, R&D, Volume Production
- Product Size: ≤ 100 x 160 mm / 3.9 x 6.3 inch
- Ball Diameter: ≥ 250 µm
- Throughput: ≥ 20 Products / hour
- Changeover Time: ≤ 30 min

Since 1949, the Wagenbrett Company designs and manufactures ultra-precision mechanical parts and assemblies for different industries - from prototype to series. Please contact us for further information.


Category: REPAIR

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