PacTech - Packaging Technologies GmbH
PacTech consists of two business units:
1. Manufacturer of equipment for the Advanced Packaging and Microelectronics Industry
2. Provider of high-quality, subcontract Wafer Level Bumping and Packaging Services.
Out of its German based headquarter and their subsidiaries in California and Malaysia, the corporation supplies its outstanding solutions in these relevant business regions.
With more than 20 years of experience, PacTech is a prime manufacturer of leading-edge technology equipment and processes for the advanced packaging industry. PacTech designs, manufactures and supports solder jetting equipment, wafer-level solder ball transfer systems, wafer-level solder rework equipment, laser assisted flip-chip bonders and automatic plating tools for high volume electro-less Ni/Au and Ni/Pd/Au Under Bump Metallurgy (UBM) and Over Pad Metallurgy (OPM) through its global sales network. In its worldwide sales and application centers PacTech offers demonstration capabilities, including assembly of samples and prototyping under ISO certified production conditions.
It is PacTech’s mission to provide the highest level of innovative technology solutions with an unparalleled degree of customer service orientation, corporate integrity and attention to its clients’ individual technology demands.