WHAT IS THE FUTURE PACKAGING?
FUTURE PACKAGING 2020
"The Line" – Staying on Your Feet and Ahead of the Curve
The sheer pace of development in electronics continues to inspire awe and has taken many observers by surprise. Human nature is to blame: We often lack the cold calculating mind and detached spirit needed to really anticipate market trends and not be left trailing in their wake.
The LINE at SMTconnect 2020 manages this balancing act in a cooperation of Fraunhofer IZM with its many engineering, technology, and process partners. Since the IZM, as part of the FMD, is already developing the technologies for the next 5 to 10 years today and sharing its insights with its project partners, there is an opportunity for everyone involved to stay ahead of the curve. This concerns a vast range of trends and currents. Be it the optimization of actual production processes or the ubiquitous topic of data connection: Each and every individual technology and process can be discussed in detail on site and new avenues found for their practical implementation.
The line of the shared "Future Packaging" exhibit intends to offer the visitors of SMTconnect 2020 an opportunity to get a full and meaningful overview, with the right people available on site to discuss constructive solutions to your challenges.