Wagenbrett GmbH & Co.KG

This year, the Wagenbrett Company introduces the current rucowa product range. While the PB46 opens up new possibilities for BGA / CSP printing and balling, the well-established WB300 can now even process ultra-thinned Wafers with ball diameters down to 200 µm. In addition, various custom solutions - for example heat resistant Wafer-Carriers - will be displayed.

WB300 – Wafer & BGA / CSP Balling:

• Substrates: Wafer, BGA / CSP, PCB
• Applications: research and development, volume production, reballing
• Substrate size: ≤ 12 inch / 300 mm
• Sphere size: 250 µm – 760 µm (200 µm optional)
• Throughput: ≥ 20 substrates / hour
• Yield: 99.998 (tested at Fraunhofer ISIT)
• Pattern change: ≤ 10 min.

PB46 – BGA / CSP Balling & Printing:

• Substrates: BGA / CSP, PCB
• Applications: reballing, volume production, research & development
• Substrate size: ≤ 4 x 6 inch / 100 x 160 mm
• Sphere size: 250 µm – 760 µm
• Pattern change: ≤ 10 min

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