Future Packaging – Technologien, Produkte, Visionen

Fraunhofer ISIT

Fraunhofer ISIT focuses on the quality and reliability of electronic assemblies, as well as rework.

In the application laboratory of Fraunhofer ISIT, manufacturers of electronic assemblies can test the introduction of novel technologies and transfer these to their existing equipment. Manufacturing processes like solder paste printing, component placement and soldering (reflow, wave, selective, vapor-phase and special soldering techniques) are fine-tuned and optimized. We also develop fine pitch solder paste printings for soldering of integrated circuits on wafer level and glass solder paste printing for sensor sealing.

In face of ongoing automation of the manufacturing of electronic assemblies, the importance of rework and repair continues to increase. Fraunhofer ISIT develops customized rework strategies, which can be performed with rework facilities at Fraunhofer ISIT or on-site.

We help our customers of Fraunhofer ISIT solve manufacturing challenges, such as increasing failure rates, and improve their products by means of quality assessment of electronic components and assemblies. ISIT can offer a wide range of destructive and non-destructive analysis methods.

www.isit.fraunhofer.de

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