Future Packaging – Technologien, Produkte, Visionen
Fraunhofer Institut für Zuverlässigkeit und Mikrointegration IZM
Fraunhofer IZM provides both technology and process development. We develop reliable assembly and interconnection technologies for microelectronics, microsystem technologies and power electronics.
Technologically speaking, Fraunhofer IZM can accompany the entire chain of technology, from wafer-level packaging, to interconnection technologies for chips and boards, right through to reliability research.
The range of services is tailored to the specific needs of our customers and includes:
- Consulting on questions of quality, reliability and environmental issues concerning products and production
- Support in the qualification of system integration technologies
- (Electronic) specific material assessment and processing
- Technological process development (including concept and specification of installation)
- Product development
- System design, assortment technology selection and accommodation of technologies
We focus on the development and qualification of interconnection technologies for board and chip:
- Mold, wire and bumping materials and glues
- Assembly and bumping technologies on wafer level
- Embedding of active and passive electronic devices on wafer level
- 3D integration on wafer and substrate level
- SMD, CSP, and BGA build-ups
- Installation, underfilling and encapsulation of flip chips
- Wire and tape bonding
- Transfer molding of flip chips, CoB and lead frames
- Chip embedding in substrates
- Coupling of optical fibers and planar wave guides
- Thin-window-glass- and photonic packaging
- Development and funictionalization of biopolymers, non-structured surfaces and new metallizations
Fraunhofer IZM develops and researches technology for projects with industry. Customers have access to cutting-edge laboratories and an array of state-of-the-art machines and systems, including our:
- Substrate and embedding line
- Flip-chip demonstration line
- Die and wire bonding center (fully automated die and wire bonding equipment for COP processes)
- Center for Micromechatronics (rapid prototyping and 3D packaging)
- Encapsulation laboratory (wafer molding and encapsulation of large-volume packages)
- Clean room with wafer level packaging line up to 300mm
- Qualification and test center for electronic packages (REM/EDX, ESCA, FIB)
- Training center for Iinterconnection Ttechnologies ZVE (instructing and damage analysis according to ESA and IPC, AZWV- certified)
- Thermoermic-mechanical laboratory for rReliability
- Micro-materials -testing
- Electronics Conditioning Monitoring Laboratory (vibration testing of vibrations, non-contact vibration probes, in-field testing of functions under field operation)