Future Packaging – Technologien, Produkte, Visionen
F&K Delvotec Bondtechnik GmbH
Chips mounted directly on the circuit, i.e. without intervening packages, are often preferred due to their lower space requirement but also thanks to their lower cost. Automotive electronics in particular demand wirebonds with both thin and heavy aluminium wires because they employ not only logic semiconductors but also power modules.
Wirebonders for such applications must provide a large working area not only in X and Y but also in Z to process large and complicated molded casings. They need multiple, programmable focus heights and, ideally, are capable of handling a large range of different component types and packages.
The bonder series G5 from F&K Delvotec with the heavy-wire model 66000 and the thin-wire sister model 64000 makes easy work of these requirements. The heavy-wire bondhead boasts self-adjusting clip-on wire guides with extremely short changeover times and also allows by a simple change of bondhead also the forward-looking HARB (Heavy Aluminium Ribbon Bonding). HARB is especially attractive for power components at very high currents, like they are employed in hybrid cars, because it combines highest productivity with excellent connection quality. A special variant of the bondhead contains an additional pulltester built right into the bondhead and capable of non-destructively checking the first and second bond separately.
Two further members of this bonder family are also on display at the SMT exhibition: the highly productive double-head model G5.2 is very successful for power components bonded with two different wire sizes, and the all-new G5 XL model is especially conceived for large-area applications like solar cells and battery modules for e-vehicles. It boasts a gigantic work area of almost 1 m² and is capable of bonding such large circuits in a single pass, simplifying component design and making them more economical.
Future material developments such as copper wire, copper ribbons or even coated materials such as aluminium-plated copper ribbons can be processed without problems on all bonder models. For particularly tricky applications, all F&K Delvotec bonders can be operated at a number of ultrasonic frequencies between 40 and 160 kHz which allows mastering even difficult materials and surfaces with excellent quality and yield.