Future Packaging – Technologien, Produkte, Visionen
F&K Delvotec Bondtechnik GmbH
Automatic Wirebonding and Automatic Bond Testing
with Wedgebonder 66000G5 and Tester 5600C
Chips mounted directly on the circuit, i.e. without intervening packages, are often preferred due to their lower space requirement but also thanks to their lower cost. Automotive electronics in particular demand wirebonds with both thin and heavy aluminium wires because they employ not only logic semiconductors but also power modules.
Wirebonders for such applications must provide a large working area not only in X and Y but also in Z to process large and complicated molded casings. They need programmable focus heights and, ideally, are capable of handling a large range of different component types and packages.
The bonder series G5 from F&K Delvotec with the heavy-wire model 66000 and the thin-wire sister model 64000 makes easy work of these requirements. The heavy-wire bondhead boasts self-adjusting clip-on wire guides with extremely short changeover times and also allows by a simple change of bondhead also the forward-looking HARB (Heavy Aluminium Ribbon Bonding). HARB is especially attractive for power components at very high currents, like they are employed in hybrid cars, because it combines highest productivity with excellent connection quality. A special variant of the bondhead contains an additional pulltester built right into the bondhead capable of non-destructively checking the first and second bond separately.
Quality assurance is customarily covered by pull and shear testers. Up to now, however, they are generally designed for manual operation, causing enormously high personnel expense. This is especially true for demanding components like those used in the automotive or microwave technology. Consequently, there are very few cases where a 100% quality check by non-destructive pull test is economically feasible – up to now, that is to say, because now F&K Delvotec offers a fully automatic tester in the 5600C which pulls or shears the wirebonds entirely without requiring an operator. This not only reduces personnel cost, but more importantly improves the testing quality enormously by completely excluding operator influence, both inadvertent and purposely. Such manipulation-proof measurements are a basic precondition for a successful zero-defect-manufacturing.